{"id":4032,"date":"2024-10-01T11:18:17","date_gmt":"2024-10-01T11:18:17","guid":{"rendered":"https:\/\/www.print3.in\/?p=4032"},"modified":"2024-10-09T11:29:12","modified_gmt":"2024-10-09T11:29:12","slug":"canon-releases-fpa-3030i6-semiconductor-lithography-system-for-small-wafers-with-a-newly-developed-lens-and-a-variety-of-options-to-meet-the-growing-demand-for-power-devices","status":"publish","type":"post","link":"https:\/\/www.print3.in\/?p=4032","title":{"rendered":"Canon releases FPA-3030i6 semiconductor lithography system for small wafers, with a newly developed lens and a variety of options to meet the growing demand for power devices"},"content":{"rendered":"<h4 style=\"text-align: justify;\"><span style=\"color: #ff1616;\"><em><strong>Canon Inc. announced today the release of the FPA-3030i6 i-line<sup>1<\/sup>\u00a0stepper, a new semiconductor lithography system for processing wafers with a diameter of 8 inches (200 mm) or smaller.<\/strong><\/em><\/span><\/h4>\n<p class=\"mText__regular\" style=\"text-align: justify;\">The FPA-3030i6 employs a newly developed projection lens that boasts high transmittance and high-durability. The system reduces lens aberration for high exposure dose processes and improves productivity by shortening exposure time.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">The lens is made of high-transmittance glass material that reduces lens aberrations occurring during exposure by more than 50%<sup>2<\/sup>\u00a0when compared to previous stepper models<sup>3<\/sup>. Higher transmittance also helps reduce exposure time while maintaining pattern fidelity, even under high exposure dose conditions.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">Improving lens transmittance will also increase exposure intensity and shorten the exposure time required for each process. The FPA-3030i6 standard productivity for 8 inch (200 mm) wafers has increased4 to 130 wafers per hour from 123 for the previous stepper models.<\/p>\n<p><img fetchpriority=\"high\" decoding=\"async\" class=\" wp-image-4033 aligncenter\" src=\"https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b-300x200.jpg\" alt=\"\" width=\"790\" height=\"526\" srcset=\"https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b-300x200.jpg 300w, https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b-500x333.jpg 500w, https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b-585x390.jpg 585w, https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b-263x175.jpg 263w, https:\/\/www.print3.in\/wp-content\/uploads\/2024\/10\/p20240924b.jpg 600w\" sizes=\"(max-width: 790px) 100vw, 790px\" \/><\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">Additionally, since the lens is highly durable, lens transmittance decrease over time is reduced and productivity can be maintained over the life of the system.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">The NA (numerical aperture) range has also been expanded from 0.45~0.63 in the previous model to 0.30~0.63. Allowing for a smaller NA enables customers to select the optimum NA for each device layer.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">Optional products including a wafer handling system for special substrates are available for order to meet users\u2019 manufacturing needs for various emerging semiconductor devices including high-power and high-efficiency green devices.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">The FPA-3030i6 is designed to support a wider range of device fabrication thanks to a variety of available process options for silicon (Si) as well as sapphire and compound semiconductor materials such as silicon carbide (SiC), gallium nitride (GaN) and gallium arsenide (GaAs) substrates.<\/p>\n<p class=\"mText__regular\" style=\"text-align: justify;\">Canon will offer wafer feeding options enabling handling of substrates from 2 inches (50 mm) to 8 inches (200 mm) in diameter, as well as thick, thin and warped substrate handling.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Canon Inc. announced today the release of the FPA-3030i6 i-line1\u00a0stepper, a new semiconductor lithography system for processing&hellip;<\/p>\n","protected":false},"author":1,"featured_media":4034,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_lmt_disableupdate":"","_lmt_disable":"","footnotes":""},"categories":[48],"tags":[],"class_list":["post-4032","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/posts\/4032","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.print3.in\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=4032"}],"version-history":[{"count":1,"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/posts\/4032\/revisions"}],"predecessor-version":[{"id":4035,"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/posts\/4032\/revisions\/4035"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.print3.in\/index.php?rest_route=\/wp\/v2\/media\/4034"}],"wp:attachment":[{"href":"https:\/\/www.print3.in\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=4032"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.print3.in\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=4032"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.print3.in\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=4032"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}